Binder USA LP, a supplier of industrial circular connectors, last week announced that it is offering connectors from its M12 series as surface-mount devices, or SMDs). It claimed that its SMDs can enable streamlined and automated processes.
The Camarillo, Calif.-based company said its SMDs are useful for further processing in fully automated processes, such as the dense, double-sided assembly of printed circuit boards (PCBs).
Binder USA said the features of its M12 SMD connectors include:
- Four, six, and eight number of contacts
- A-, B-, D-, and X-coded
- IP67 protection class
- Compact and easy to automate processing, binder says
- Available in shielded and unshielded versions
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Binder USA builds connectors for industrial applications
Binder USA added that its SMD connectors are suitable for robotics, factory and process automation, instrumentation, sensors, and actuators. The company offers them as a set with different flange housings, as a built-in part in blister packaging, or in tape and reel packaging for automated processing.
In contrast to classic through-hole technology or through-hole reflow process, Binder explained that its SMD contact pins are placed directly on the surface in the surface-mount technology (SMT) process and connected using solder paste instead of inserted through the PCB and then soldered.
Binder said this allows for significant space savings. For example, many connectors can be mounted at very small distances in one plane, as is required for passive/active sensor distributors in automation technology.
Binder USA is a unit of Franz Binder GmbH & Co. Elektrische Bauelemente KG, a global manufacturer of circular connectors, custom cord sets, and LED lights. Binder USA said its products are used around the world in industrial environments for factory automation, process control, and medical technology applications.
In late 2023, the company expanded its 823/824 product series with K- and L-coded over-molded cable components that meet the UL 2238 standard for North America. Binder said the transmission of electrical power via compact M12 interfaces has become a fundamental requirement. The new components provide power transmission to field devices, such as sensors, wireless transmitters, and fieldbus devices.
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