LUCID Vision Labs, which develops industrial vision cameras, today announced the series production of its new Helios Flex 3D time-of-flight module. The module can be integrated into embedded platforms for industrial and robotics applications.
The pre-calibrated time-of-flight MIPI module features Sony’s DepthSense IMX556PLR back-illuminated ToF image sensor, and includes four 850nm VCSEL laser diodes, LUCID said. It connects to an embedded system using NVIDIA’s Jetson TX2 and can deliver 640 by 480 depth resolution at up to 6 meters distance. The Helios Flex module also includes a software development kit with GPU-accelerated depth processing, and runs at 30 frames per second.
Accelerated depth processing
The Richmond, British Columbia-based company said more vision applications are implementing 3D sensing using embedded platforms in order to take advantage of their processing power available in a compact size and at a low cost. The Helios Flex ToF module can be integrated with embedded platforms such as the Jetson TX2 for accelerated depth processing.
“Featuring Sony’s advanced depth sensing technology, the Helios Flex module allows users to leverage a high-performance 3D Time-of-Flight camera on a cost-effective, compact embedded system,” said Rod Barman, founder and president of LUCID Vision Labs. “The module is the first-to-market with Sony’s new DepthSense Time-of-Flight sensor, which enables OEMs to build their own embedded 3D system using the latest ToF technology.”
LUCID said its ArenaFlex SDK includes easy-to-use controls for the Helios Flex ToF module, and its GUI can show the intensity and depth of a scene in either a 2D view or 3D point cloud view, which can be manipulated and oriented in real time. Settings can also be adjusted and seen in real time, including false color overlay and depth range.
Pricing on the module was not announced. More details are available via the Helios Flex product page.
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